Advanced Power Semiconductor Wafer Machining Expo 2027 – Chiba, Japan

• March 10, 2027
  Event date:
• March 12, 2027
  Event end:

What to expect

Advanced Power Semiconductor Wafer Machining Expo 2027 – Chiba, Japan, also known as SiC, GaN Machining Technology Exhibition, is a highly specialized technical exhibition focusing on machining, grinding, and processing technologies for advanced power semiconductor wafers such as silicon carbide and gallium nitride. Organized by Japan Industrial Publishing Co., Ltd. and Sankei Shimbun Co., Ltd., the event is held concurrently with Grinding Technology Japan, an exhibition specializing in grinding technology, creating a unique platform where power semiconductor and precision machining communities intersect.

What to expect is an exhibition where you can find answers for your site, dedicated to solving real manufacturing challenges in SiC and GaN wafer processing. The expo brings together domestic and international manufacturers of grinding machines and peripherals, abrasive technologies, diamond tools, and research institutes. Exhibits include resin bond diamond grinding pads, metal bond diamond grinding pads, metal composite grinding pads, ultra-fine diamond manufacturing technology, slicing, lapping, polishing, and dicing solutions for hard and brittle materials.

The event attracts highly engaged visitors including engineers, production managers, and researchers from power semiconductor device manufacturers, wafer suppliers, and equipment makers. It serves as a platform for technology demonstration, technical consultation, and business development in the rapidly expanding SiC and GaN power electronics market.

Event dates

Exhibition Name: Advanced Power Semiconductor Wafer Machining Expo 2027 – SiC, GaN Machining Technology Exhibition 2027

Co-located Exhibition: Grinding Technology Japan 2027 – GTJ 2027 – 4th edition since 2019

Organizers: Japan Industrial Publishing Co., Ltd. and Sankei Shimbun Co., Ltd.

Venue: Makuhari Messe, Hall 7-8 (TBC), Chiba, Japan

Official Website: https://sicgan-expo.jp/2027/

Contact: Application/Inquiries – 1-7-2 Otemachi, Chiyodaku, Tokyo 100-8125, Japan – TEL +81-3-3273-6180 – FAX +81-3-3241-4999 – Email sicgan@sankei.co.jp

Event Period: March 10 (Wed.) – 12 (Fri.), 2027

Daily Schedule:

March 10, 2027: Wednesday, first exhibition day, opening at 10:00 am, start of exhibition, technology demonstrations, and seminars

March 11, 2027: Thursday, second exhibition day, full day exhibition and concurrent seminar programme

March 12, 2027: Friday, third and final exhibition day, closing at 5:00 pm

Opening Hours: 10:00 am to 5:00 pm for all three days

All main exhibition activities are held within this three-day period at Makuhari Messe.

Visiting this event? Don’t miss out on these amazing activities and local experiences while you’re here.

Venue & exhibition site

Venue Name: Makuhari Messe – Nippon Convention Center

Location Detail: Hall 7-8 (TBC), 2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture, Japan

Venue Profile: Makuhari Messe is one of Japan’s largest convention complexes, located in Chiba Bay area with excellent access from central Tokyo. Hall 7-8 provides spacious, high-ceiling exhibition space suitable for large grinding machines, precision equipment, and live demonstrations. The venue has previously hosted SiC, GaN Machining Technology Exhibition in Hall 8.

Exhibition Site Features: The site includes dedicated exhibition area for SiC and GaN machining technologies, Grinding Technology Japan zone, seminar rooms for technical presentations, Japan Society for Abrasive Technology Exhibition Corner, and special pavilions such as China Pavilion and New Material corners.

Facilities: Loading docks for heavy machinery, high-power electrical supply for equipment operation, compressed air lines, and technical support services for machine demonstrations. Seminar rooms adjacent to exhibition halls host concurrent technical sessions.

Co-location Context: Held concurrently with Grinding Technology Japan, which specializes in exhibitions focusing on tool manufacturing and grinding technology, allowing visitors to see complete process chain from conventional grinding to advanced power semiconductor wafer processing.

Full event programme

The full event programme is designed to showcase practical machining solutions and foster technical exchange.

Exhibition Programme: Core programme features exhibits of grinding machines, diamond grinding pads, metal composite pads, lapping and polishing machines, slicing equipment, dicing saws, and inspection systems specifically for SiC and GaN wafers. Exhibited products include resin bond diamond grinding pad SQUADRO-G2, metal bond diamond grinding pad PLATO, and liquid diamond GAF for slurry formulation.

Grinding Technology Programme: Concurrent Grinding Technology Japan exhibition presents grinding machines, grinding wheels, abrasive technologies, and peripheral equipment for tool manufacturing.

Seminar Programme: Technical seminars organized by Japan Society for Abrasive Technology and cooperating organizations, covering topics such as ultra-fine diamond manufacturing technology for mechanical fine processing, SiC wafer thinning techniques, and GaN surface finishing challenges.

Demonstration Programme: Live demonstrations of grinding pads enhancing performance of existing grinding machines, mechanical fine processing technologies, and coagulation-free polishing solutions.

Industry Pavilion Programme: Special corners including China Pavilion with exhibitors such as Zhengzhou Xiangyu Sansui New Material, Henan Boreas, Henan HengXin, and other international material suppliers.

Networking Programme: Technical consultation corners where exhibitors provide direct answers for production site challenges.

Key speakers & keynote speakers

Key speakers and keynote speakers at Advanced Power Semiconductor Wafer Machining Expo are technical experts from industry and academia.

Special Support Speaker: The Japan Society for Abrasive Technology Advanced Power Semiconductors Division provides technical leadership, with experts presenting on abrasive technology advancements for SiC and GaN processing.

Industry Leaders: Senior engineers from leading grinding machine manufacturers, diamond tool producers, and SiC wafer manufacturers share case studies on improving yield and reducing wafer damage.

Research Institute Speakers: Researchers from SiC Alliance, Consortium for GaN Research and Applications, and Tsukuba Power-Electronics Constellations present latest findings on wafer processing requirements for next-generation power devices.

Supporting Organization Experts: Representatives from supporting organizations such as Japan Machine Tool Builders Association, Japan Precision Machine Association, and Industrial Diamond Association of Japan discuss standardization and technology trends.

Engagement Format: Technical seminars in dedicated seminar rooms, with presentation materials including technical data on grinding pad performance, surface roughness measurements, and cost reduction examples.

Conference sessions & tracks

Conference sessions and tracks focus on practical machining solutions for advanced power semiconductor wafers.

Track – SiC Wafer Machining: Grinding, lapping, and polishing technologies for silicon carbide wafers, addressing hardness and brittleness challenges, including resin bond and metal bond diamond pad solutions.

Track – GaN Wafer Processing: Machining technologies for gallium nitride wafers, including substrate thinning, surface finishing, and defect reduction techniques.

Track – Grinding Technology: Latest developments in grinding machines, grinding wheels, and peripheral equipment, including automation and precision control for tool manufacturing.

Track – Abrasive and Diamond Technologies: Ultra-fine diamond manufacturing technology, liquid diamond GAF for slurry formulation, and metal composite material grinding pads enhancing performance of existing grinding machines.

Track – Inspection and Measurement: Optical measuring instruments, precision measuring instruments, and quality control for SiC and GaN wafers.

Track – Power Device Application: Link between wafer machining quality and power semiconductor device performance, with insights from SiC Alliance and power electronics manufacturers.

Each track includes technical presentations with specific product examples and process data.

Session times & schedule

Session times and schedule are organized to allow thorough exploration of exhibition and seminars.

Morning Sessions: Morning hours from 10:00 am opening include exhibition viewing, machine demonstrations, and first round of technical seminars in seminar rooms adjacent to Hall 8.

Midday Sessions: Late morning to early afternoon includes peak exhibition hours with live grinding demonstrations, product sampling, and Q&A with exhibitors such as Pure on Japan booth.

Afternoon Sessions: Afternoon periods continue exhibition activities, technical consultations, and seminar sessions covering topics like metal composite grinding pads and slurry formulation.

Daily Structure: Exhibition open 10:00 am to 5:00 pm for all three days, with seminars scheduled in parallel to avoid crowding. Final day closing at 5:00 pm.

Programme Guide: Detailed session schedule provided in exhibition guide distributed at entrance and via official website, with map showing booth locations such as G-108, G-107, G-106, and meeting areas.

Ticket types & registration

Ticket types and registration for Advanced Power Semiconductor Wafer Machining Expo are designed for professional visitors, with previous edition pricing converted to USD.

General Admission Ticket:

On-site Admission: 13 USD – Equivalent to 2,000 JPY, standard admission fee for visitors without invitation or pre-registration. Valid for 3 days for both SiC, GaN Machining Technology Exhibition and Grinding Technology Japan.

Free Admission Options:

Invitation Ticket: 0 USD – Free admission with invitation ticket distributed by exhibitors, supporting organizations, and organizers. Invitation holders enter without charge.

Online Pre-registration: 0 USD – Free admission with online pre-registration via official website https://sicgan-expo.jp/2027/. Pre-registered visitors receive QR code for direct entry.

Exhibitor Passes: Exhibitor badges included in exhibitor package, with additional staff badges available at no charge within allocation.

Seminar Participation: Technical seminars organized by Japan Society for Abrasive Technology and cooperating organizations included in admission fee, with seating on first-come basis.

Important Notes: Entrance fee free with preregistration as per previous editions. All registration completed online, with e-ticket system. Visitors encouraged to pre-register to avoid on-site payment queue and ensure entry.

Pricing Basis: Based on 2025 edition where entrance fee was free with preregistration and 2,000 yen otherwise, as stated on official site.

Registration deadlines

Registration deadlines are enforced to ensure smooth entry and planning.

Online Pre-registration Deadline: Online pre-registration for free admission typically remains open until day before exhibition opening, but early pre-registration recommended to secure free entry and receive exhibition guide in advance.

Exhibitor Application Deadline: Exhibitor applications must be submitted several months before event, with stand allocation on first-come, first-served basis. Contact organizers at sicgan@sankei.co.jp for application details.

Invitation Ticket Request Deadline: Requests for invitation tickets from exhibitors should be made at least two weeks before event to allow for mailing or digital distribution.

Seminar Registration: No separate registration required for seminars, but seating limited, early arrival recommended.

On-site Registration: On-site registration available at Makuhari Messe Hall 7-8 entrance during exhibition hours 10:00 am to 5:00 pm, with admission fee of 2,000 JPY if without invitation or pre-registration.

Visa Support: For international visitors requiring invitation letters, request via organizers at least one month before event.

Exhibitor list & major companies

Exhibitor list and major companies reflect specialized nature of advanced power semiconductor wafer machining.

Exhibitor Categories: Exhibitors include manufacturers of grinding machines, lapping and polishing machines, diamond grinding pads, metal composite pads, slicing equipment, abrasive materials, and inspection systems for SiC and GaN wafers.

Confirmed Exhibitor Types from Previous Edition: Pure on Japan exhibiting resin bond diamond grinding pad SQUADRO-G2 and metal bond diamond grinding pad PLATO, companies specializing in ultra-fine diamond manufacturing technology, and metal composite material grinding pad IRINO.

International Exhibitors: Exhibitors from China including Zhengzhou Xiangyu Sansui New Material, Henan Boreas, Henan HengXin Industrial and Mineral Products, Henan SEPPE Technologies, and other new material suppliers.

Domestic Exhibitors: Japanese manufacturers of precision machinery, abrasive technologies, and power semiconductor materials.

Scale: In 2025 edition held at Makuhari Messe Exhibition Hall 8, event attracted over 6,500 visitors over three days and featured 172 exhibitors including domestic and international manufacturers of grinding machines and peripherals and research institutes.

Supporting Exhibitors: Members of supporting organizations exhibiting peripheral technologies.

Exhibition halls & floor plan

Exhibition halls and floor plan are designed for machinery demonstration and technical consultation.

Hall 7-8 Layout: Makuhari Messe Hall 7-8 provides column-free exhibition space with high ceilings suitable for large grinding machines. Floor plan divided into zones – SiC, GaN Machining Technology Exhibition zone, Grinding Technology Japan zone, Japan Society for Abrasive Technology Exhibition Corner, and China Pavilion.

Booth Numbering: Booths numbered systematically such as G-108, G-107, G-106, G-105, G-104, G-102, G-101, and S-47, S-48, S-51 for dual-registered companies, with meeting areas and seminar rooms adjacent.

Demonstration Areas: Dedicated areas for live machine operation with safety barriers, dust collection, and noise control.

Seminar Rooms: Seminar rooms located near exhibition halls, including main seminar room and smaller meeting rooms for technical sessions.

Visitor Services: Information counter at hall entrance providing floor plans, exhibitor lists, and seminar schedules. Exhibition guide includes detailed map.

Logistics: Loading docks for heavy machinery, high-power electrical connections, and storage areas for exhibitor materials.

Networking & business meetings

Networking and business meetings are core to technical exhibition value.

Technical Consultation: Exhibition concept as exhibition where you can find answers for your site encourages direct consultation between visitors facing machining challenges and exhibitors offering solutions.

Business Meeting Areas: Meeting areas such as Meeting Henan Boreas Corner and general meeting spaces provide quiet areas for business discussions.

Industry Association Networking: Presence of many supporting organizations facilitates networking with industry associations and research consortia.

International Networking: China Pavilion and international exhibitors provide opportunities for cross-border technology partnerships.

Seminar Networking: Seminar rooms allow interaction with speakers from Japan Society for Abrasive Technology, SiC Alliance, and other research groups.

Evening Events: Informal networking among exhibitors and visitors after exhibition hours in nearby hotels and restaurants in Makuhari area.

Industry sectors & highlights

Industry sectors and highlights reflect critical role of SiC and GaN in power electronics revolution.

Advanced Power Semiconductor Sector: Silicon carbide and gallium nitride wafers for next-generation power devices, enabling high-efficiency power conversion.

Grinding Technology Sector: Grinding machines, grinding wheels, and peripheral equipment for precision machining of hard materials.

Abrasive Technology Sector: Diamond abrasives, resin bond and metal bond grinding pads, and slurry technologies.

Machine Tool Sector: Machine tools, forming machinery, precision machines, cutting and wear-resistant tools, and machine accessories.

Measurement Sector: Precision measuring instruments, optical measuring instruments, and fluid power systems for quality control.

Highlights: Focus on solving real manufacturing challenges for SiC and GaN wafers, which are harder and more brittle than silicon, requiring specialized machining technologies. Exhibition highlights practical solutions that enhance performance of existing grinding machines, reduce processing costs, and improve surface quality for power semiconductor devices. Special support from Advanced Power Semiconductors Division of Japan Society for Abrasive Technology ensures technical depth.

Event rules & visitor information

Admission Policy: Exhibition is open to professionals and general public interested in power semiconductor machining and grinding technology. Admission fee 2,000 JPY, free with invitation ticket or online pre-registration.

Badge Policy: Visitor badges must be worn visibly. Non-transferable.

Safety Rules: Safety glasses required in machine demonstration areas. Follow instructions from exhibitors when operating or observing machinery. Emergency exits clearly marked.

Photography Policy: Photography may be restricted in certain booths at exhibitor’s discretion. General photography for personal business use allowed, but commercial photography requires permission.

Noise and Dust: Grinding demonstrations may generate noise and dust. Ear protection and masks available at demonstration areas.

Conduct: Professional conduct expected. Organizer reserves right to remove visitors violating rules.

Payment: On-site admission payable in Japanese Yen. Credit cards may be accepted.

Pre-registration Benefit: Free with preregistration encourages advance planning and provides organizers with visitor data for better service.

How to get there

By Train: Makuhari Messe is accessible via JR Keiyo Line to Kaihin-Makuhari Station, which is directly connected to venue via pedestrian walkway. From Tokyo Station, take JR Keiyo Line to Kaihin-Makuhari, travel time approximately 35 minutes, cost around 4 USD to 6 USD.

From Airports: From Narita Airport, take JR Narita Express or Access Express to Tokyo then Keiyo Line, or take airport limousine bus to Makuhari area hotels, travel time approximately 60 to 90 minutes, cost around 10 USD to 25 USD. From Haneda Airport, take Tokyo Monorail to Tennozu then JR to Kaihin-Makuhari.

By Taxi: Taxi from central Tokyo to Makuhari Messe takes 40 to 60 minutes depending on traffic, costing approximately 60 USD to 100 USD. From Kaihin-Makuhari Station to venue is short walk, taxi not needed.

Walking: From Kaihin-Makuhari Station, follow signs to Makuhari Messe via covered walkway, approximately 5 minutes walk to Hall 7-8.

Public transport & parking

Public Transport: JR Keiyo Line provides direct access to Kaihin-Makuhari Station. Also accessible via JR Sobu Line and Keisei Line with transfers. Frequent service during exhibition period.

IC Cards: Suica, Pasmo, and other IC cards accepted on JR lines and buses.

Parking: Makuhari Messe has large on-site parking facilities with capacity for thousands of vehicles, but spaces fill quickly during large events. Parking fee typically 6 USD to 10 USD per day. Public transport recommended due to expected attendance and heavy machinery transport.

Bus Services: Shuttle buses operate between Kaihin-Makuhari Station and Makuhari Messe during large exhibitions, plus local buses serving Chiba area.

Accessibility: Kaihin-Makuhari Station has elevators and escalators. Makuhari Messe is fully barrier-free with elevators, accessible restrooms, and wide aisles for machinery movement.

Accommodation areas

Makuhari Area: Closest to venue, hotels ranging from 80 USD to 200 USD per night, including APA Hotel Tokyo Bay Makuhari, Hotel New Otani Makuhari, and Hotel Francs. Highly convenient for exhibitors with heavy equipment.

Chiba City Area: Hotels from 60 USD to 150 USD, including Mitsui Garden Hotel Chiba and Richmond Hotel Chiba, accessible via JR Keiyo Line.

Tokyo Station and Marunouchi Area: Major hotel hub, hotels from 100 USD to 300 USD, convenient for international visitors.

Booking Advice: Hotels during exhibition season in Makuhari area fill quickly due to concurrent events. Early booking at least two months in advance recommended, especially for exhibitors requiring early access for machine setup.

Previous year’s highlights

Previous year’s highlights demonstrate strong technical focus and engaged audience.

The SiC, GaN Machining Technology Exhibition 2025 was held concurrently with Grinding Technology Japan 2025 for three days from March 5 to 7, 2025, at Makuhari Messe Exhibition Hall 8. The event was held for the fourth time after first being held in 2019, showing steady growth.

Grinding Technology Japan 2025 attracted over 6,500 visitors over three days and featured 172 exhibitors including domestic and international manufacturers of grinding machines and peripherals and research institutes, indicating highly focused and technically engaged audience.

Exhibits included diamond grinding pads, metal composite pads, and ultra-fine diamond technologies that drew significant interest from power semiconductor manufacturers facing challenges in SiC wafer thinning and surface finishing. Technical seminars by Japan Society for Abrasive Technology were well attended.

Visitors praised exhibition concept as exhibition where you can find answers for your site, with many reporting solutions found for production challenges. The co-location with Grinding Technology Japan allowed cross-fertilization between conventional grinding expertise and emerging SiC and GaN processing needs.

Official registration & tickets

Official Website: https://sicgan-expo.jp/2027/en/

Organizers: Japan Industrial Publishing Co., Ltd. and Sankei Shimbun Co., Ltd.

Contact: 1-7-2 Otemachi, Chiyodaku, Tokyo 100-8125, Japan – TEL +81-3-3273-6180 – FAX +81-3-3241-4999 – Email sicgan@sankei.co.jp

Admission: 2,000 yen – Free with an invitation ticket or online pre-registration – Equivalent to 13 USD standard admission, free with pre-registration

Venue: Makuhari Messe, Hall 7-8 (TBC), 2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture

Special Support: The Japan Society for Abrasive Technology Advanced Power Semiconductors Division

Supporting Organizations: Japan Machine Tool Builders Association, Japan Machine Tool Importers’ Association, Japan Machine Tool Distributors Association, Japan Forming Machinery Association, Japan Precision Machine Association, Japan Cutting & Wear-resistant Tool Association, Japan Machine Accessory Association, Japan Precision Measuring Instruments Manufacturers Association, Japan Grinding Wheel Association, Industrial Diamond Association of Japan, Japan Optical Measuring Instruments Manufacturers Association, Japan Fluid Power Association, Japan Gear Manufacturers Association, Japan Industrial Saw and Knife Association, The Japan Society for Precision Engineering, The Japan Fluid Power System Society, Turbomachinery Society of Japan, SiC Alliance, Consortium for GaN Research and Applications, Tsukuba Power-Electronics Constellations (TBC)

Registration Method: Online pre-registration via official website provides free entry QR code. On-site registration available at entrance during exhibition hours.

All official information, including exhibitor list, floor plan, and seminar programme, should be obtained from official website.

Location

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